Innovative Advanced Materials (IAMs) for photonics, enabling low-power and ultra-broadband performance for telecommunication (RIA) (Innovative Advanced Materials for Europe partnership)

The main goal of this opportunity is to develop and demonstrate innovative solutions using advanced materials, especially two-dimensional materials, for high-performance and low-power photonics and optoelectronics. Focus areas include ultrafast integrated photonic circuits, next-generation wireless telecommunications, and optical interconnects for data centers, high-performance computing, and AI/ML systems. Projects are expected to prove scalability for mass production, ensure compatibility with current photonic platforms and low-voltage electronics, and integrate the full value chain to bring new devices to market. The geographic scope covers the European Union and Associated Countries, with strong encouragement to collaborate with European research infrastructures and national projects. Legal entities in China are not eligible for this program.

• Participants must be from eligible countries as defined by the Horizon Europe program.
• Proposals must follow page limits, structure, and layout as specified in the application guidelines.
• Projects must address the protection and integration of European communication networks and value chains.
• Focus must be on innovative advanced materials for photonics and optoelectronics, demonstrating scalability and compatibility with existing platforms.
• Prototypes must be developed and tested in relevant environments.
• Proposals should align with evaluation, legal, and financial criteria as set by the program.

Examples of admissible projects:

• Developing a scalable manufacturing process for 2D material-based photonic chips compatible with current telecom networks.
• Creating ultrafast optical interconnects for AI data centers using innovative materials, with testing in real-world environments.
• Demonstrating a low-power, high-speed wireless communication module based on advanced optoelectronic materials, ready for industrialization.

• Personnel costs
• Subcontracting
• Travel and subsistence
• Equipment (depreciation or rental)
• Consumables and materials
• Dissemination and communication
• Access to research infrastructure
• IPR and certification
• Audit costs
• Indirect costs (25% flat rate)
• Internally invoiced services

• Budget for this Call: 10.000.000€
• Number of Grants attributed: 2
• Budget per project: 5.000.000€

• Applicants must be established in eligible countries as defined by the Horizon Europe program.
• Legal entities from China are not eligible to participate in this program.
• Proposals must comply with all submission guidelines, including structure and page limits.
• Applicants must ensure their project addresses the integration of the value chain and protection of European communication networks.
• Projects should demonstrate scalability, compatibility, and a clear exploitation strategy for industrialization.
• Applicants are encouraged to connect with European research infrastructures and national projects.
• Eligibility may depend on forming networks or partnerships as outlined in the program guidelines.